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2003

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2003

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Suppliers news

February 19, 2003

IBM introduces new enterprise-class storage solution for medium-size companies

IBM is broadening its line of storage solutions for medium-sized companies with new enterprise-class products, including a new high-end version of its midrange disk and the next generation midrange tape storage. IBM is also adding software support and switches to deliver a complete storage network solution.

February 19, 2003

Intel Reveals PCI Express Product Plans And Extends Enabling Programs

Intel Corporation announced the delivery of enabling programs and new product plans aimed at accelerating development and delivery of PCI Express technology across computing and communications platforms.

February 19, 2003

Kingston ValueRAM DDR400 Memory Modules Pass Intel System Validation Testing

Kingston® Technology Company, Inc. announced the validation of DDR400 (PC3200) memory modules for system builders and PC enthusiasts supporting Intel’s DDR400 Pentium® 4 processor desktop and workstation platforms, which were announced today at the Intel® Developer Forum in San Jose.

February 19, 2003

Samsung Ready to Meet Industry Demand with Intel Validation for DDR400

Samsung Electronics Co., Ltd. announced that its DDR400 has passed Intel system validation for Springdale and is 100% compliant with the Intel specification. Samsung’s high-speed Double Data Rate DDR400 SDRAM is in volume production, achieving high yields and cost efficiencies, to ensure supply of the advanced memory chips required to optimize Intel’s Springdale chipset.

February 18, 2003

LSI Logic First-to-Market With Four-Channel Ultra320 PCI-X SCSI RAID Solutions

LSI Logic Corporation announced it has begun shipping production samples of the market's first quad-channel PCI-X SCSI RAID storage adapters with Ultra320 SCSI performance. Designed for enterprise-class computing platforms, LSI Logic's new family of Ultra320 SCSI RAID products with PCI-X support are targeted at the critical need for high-bandwidth server and storage environments.

February 18, 2003

SEAGATE DEMONSTRATES SERIAL ATA COMMAND QUEUING ON NEW BARRACUDA

At the Intel Developer Forum in San Jose, Seagate is demonstrating the first Serial ATA hard drive to offer Native Command Queuing, out-of-order delivery and first-party DMA (Direct Memory Access) technologies - features that are enabled on Seagate's newest Serial ATA hard drive, the Barracuda 7200.7.

February 18, 2003

Fujitsu Announces Availability Of Its 2.3GB Removable Storage Drive With Hi-Speed USB At Intel Devel

Fujitsu announced volume availability of its 2.3GB removable storage product, the DynaMO 2300U2, at the Intel Developer Forum (IDF) in San Jose. Fujitsu's DynaMO 2300U2, equipped with the Hi-Speed USB interface, is ideal for consumers and professionals that require durable, high-capacity, cost-effective external storage for intensive digital audio and video, data backup, and demanding desktop applications at less than a penny per megabyte.

February 18, 2003

Intel To Convert Arizona Factory To 300 MM Technology

Intel Corporation disclosed plans to convert Fab 12, a 200-mm wafer fabrication facility located in Chandler, Ariz. to a 300-mm wafer fab. The conversion project will begin in the first half of 2004 with production scheduled to begin in late 2005. The converted fab will start up production on 65-nanometer process technology.

February 17, 2003

Samsung and Infineon Demonstrate Smart Phone System Solutions

Samsung Electronics and Infineon Technologies announced a co-operation to provide a comprehensive smartphone system solution, based on Symbian OS, that will significantly reduce development time.

February 17, 2003

Microsoft and Intel Unveil Windows Powered Smartphone Concept Design Based on Intel Personal Interne

At 3GSM World Congress 2003, Microsoft Corp. and Intel announced the immediate availability of the first Microsoft and Intel Windows® Powered Smartphone concept design based on the Intel® Personal Internet Client Architecture (Intel PCA). The joint hardware-software concept design allows manufacturers to expedite development and reduce the cost of bringing advanced, data-enabled handsets to market.

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